(Cu): 5.2% + (S): 2.4%

Copper (metallic) 5.2 % Sulfur (metallic) 2.4 %

A dual copper–sulfur formulation that provides contact protection against a broad range of fungal and bacterial pathogens while supporting mite suppression. Ensures strong surface coverage, fast action, and resistance management as part of integrated disease control programs in orchards and vegetables.